United States International Trade Commision Rulings And Harmonized Tariff Schedule

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HTS Number: 9902.01.85

Description: Epoxy molding compounds, of a kind used for encapsulating integrated circuits (provided for in subheading 3907.30.00)
MFN Duty Rate: Free

Previous Tariff (9902.01.84 - Mixtures of Foramsulfuron (CAS No. 173159 57 4) and application adjuvants (provided for in subheading 3808.30.15))
Next Tariff (9902.01.86 - Dimethyldicyane (2,2 -dimethyl-4,4 -methylenebis(cyclohexylamine)) (CAS No. 6864 37 5) (provided for in subheading 2921.30.30))