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HTS Number: 8477.59.40

Description: Liquid encapsulate molding machines for encapsulation in the assembly of semiconductors
MFN Duty Rate: Free

Previous Tariff (8477.59.01 - Machinery for molding or otherwise forming rubber or plastics other than for molding or retreading pneumatic tires, nesoi)
Next Tariff (8477.59.80 - Machinery for molding or otherwise forming rubber or plastics other than for molding or retreading pneumatic tires, nesoi)