United States International Trade Commision Rulings And Harmonized Tariff Schedule

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HTS Number: 8464.20.10

Description: Grinding or polishing machines for processing of semiconductor wafers
MFN Duty Rate: Free

Previous Tariff (8464.20.01 - Grinding or polishing machines for working stone, ceramics, concrete, asbestos-cement or like mineral materials, or glass, nesi)
Next Tariff (8464.20.50 - Grinding or polishing machines for working stone, ceramics, concrete, asbestos-cement or like mineral materials, or glass, nesi)

Related Rulings:

• 1998 NY B88697 - The tariff classification of lapping and polishing machines for semiconductor wafers from Germany.
• 1998 NY C83458 - The tariff classification of semiconductor wafer polishers and notch pad conditioners from Japan.
• 1999 NY D87398 - The tariff classification of semiconductor wafer edge grinders from Japan.
• 1999 NY D87399 - The tariff classification of wafer lappers from Japan
• 1999 NY D87400 - The tariff classification of semiconductor wafer polishers, spin dryers and wafer packing machines from Japan.