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NY D81954




September 25, 1998

CLA-2-84:RR:NC:1:104 D81954

CATEGORY: CLASSIFICATION

TARIFF NO.: 8456.99.7000

Ms. Peg Verranault
Balzers Process Systems, Inc.
25 Sagamore Park Road
Hudson, NH 03051

RE: The tariff classification of an etch cleaning system for semiconductor wafers from Switzerland.

Dear Ms. Verranault:

In your letter dated August 27, 1998 you requested a tariff classification ruling.

The ORF 900 RF Etch System is used primarily for cleaning. (The system lacks the precision required for the shaping of circuitry on wafers.) It removes the native oxide of the wafer prior to bumb metalization. This sputter etch cleaning process prepares the final metal pad of the wafer for the 100% contact formation prior to the deposition of the bump metals. The system essentially consists of a process chamber, vacuum pumping system, cryocompressor and control rack with power supply and RF generator.

The applicable subheading for the ORF 900 RF Etch System will be 8456.99.7000, Harmonized Tariff Schedule of the United States (HTS), which provides for machine tools for working any material by removal of material, by ... ionic beam or plasma arc processes: other: other: other: for stripping and cleaning semiconductor wafers. The rate of duty will be 1.3 percent.

This ruling is being issued under the provisions of Part 177 of the Customs Regulations (19 C.F.R. 177).

A copy of the ruling or the control number indicated above should be provided with the entry documents filed at the time this merchandise is imported. If you have any questions regarding the ruling, contact National Import Specialist Robert Losche at 212-466-5670.

Sincerely,

Robert B. Swierupski
Director,

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